|
Available case studies and technical documents for wire applications: Bonding Integrity in Copper Clad Aluminum Wire For inquiries click here.
|
 |
Wire
The ARIS system has proven to be effective in defect analysis and as a process control tool. Wire of any alloy and bi-metallic wire can be tested at the time of production and at production speed. Analytical capabilities for wire include: |
|
Surface and subsurface defects: |
sensitivity to better than .002 in. surface depth | |
| sensitivity to better than 5.2 x 10-10 in3. subsurface defect volume | ||
| Porosity and inclusions: | sensitivity to better than 5.2 x 10-10 in3. subsurface defect volume | |
| Hardness / annealing: | sensitivity to 1.2 Rockwell | |
| Alloy identification | ||
| Dimensional verification: | ||
| Cladding and plating integrity |
|
Available case studies and technical documents for wire applications: Bonding Integrity in Copper Clad Aluminum Wire For inquiries click here.
|
|